Module capsules::tmp006
[−]
[src]
Driver for the TI TMP006 infrared thermopile contactless temperature sensor.
http://www.ti.com/product/TMP006
The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.
Reexports
use core::cell::Cell; |
use kernel::AppId; |
use kernel::Callback; |
use kernel::Driver; |
use kernel::ReturnCode; |
use kernel::common::math::get_errno; |
use kernel::common::math::sqrtf32; |
use kernel::common::take_cell::TakeCell; |
use kernel::hil::gpio::Client; |
use kernel::hil::gpio::InterruptMode; |
use kernel::hil::gpio::Pin; |
use kernel::hil::i2c; |
Structs
TMP006 |
Enums
ProtocolState |
States of the I2C protocol with the TMP006. There are three sequences: |
Registers |
Constants
A_1 | |
A_2 | |
B_0 | |
B_1 | |
B_2 | |
C_2 | |
C_TO_K | |
DEFAULT_SAMPLING_RATE | |
K_TO_C | |
MAX_SAMPLING_RATE | |
NV_TO_V | |
S_0 | |
T_DIE_CONVERT | |
T_REF | |
V_OBJ_CONVERT |
Statics
BUFFER |
Functions
calculate_temperature |
Type Definitions
SensorVoltage |