Module capsules::tmp006 [] [src]

Driver for the TI TMP006 infrared thermopile contactless temperature sensor.

http://www.ti.com/product/TMP006

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

Reexports

use core::cell::Cell;
use kernel::AppId;
use kernel::Callback;
use kernel::Driver;
use kernel::ReturnCode;
use kernel::common::math::get_errno;
use kernel::common::math::sqrtf32;
use kernel::common::take_cell::TakeCell;
use kernel::hil::gpio::Client;
use kernel::hil::gpio::InterruptMode;
use kernel::hil::gpio::Pin;
use kernel::hil::i2c;

Structs

TMP006

Enums

ProtocolState

States of the I2C protocol with the TMP006. There are three sequences:

Registers

Constants

A_1
A_2
B_0
B_1
B_2
C_2
C_TO_K
DEFAULT_SAMPLING_RATE
K_TO_C
MAX_SAMPLING_RATE
NV_TO_V
S_0
T_DIE_CONVERT
T_REF
V_OBJ_CONVERT

Statics

BUFFER

Functions

calculate_temperature

Type Definitions

SensorVoltage